Semi-Supervised Learning for Hyperspectral Images by Non Parametrically Predicting View AssignmentCRediT
IGARSS 2023 - 2023 IEEE International Geoscience and Remote Sensing Symposium IEEE (2023) 6085-6088
Above Ground Carbon Biomass Estimate with Physics-Informed Deep Network
International Geoscience and Remote Sensing Symposium IGARSS 2023-July (2023) 1297-1300
Abstract:
Nature-based carbon sequestration solution have the potential to capture carbon dioxide from the atmosphere and store it in vegetation biomass or soil. Forests are covering around 30% of Earth's land surface and combined with forest longevity, trees/soil have the potential to store carbon from decades to centuries. One key challenge is to develop methodologies for high-resolution measurements of carbon sequestered and assess year to year change. Here, we use deep neural network to generate a wall-to-wall map of AGB within the Continental USA (CONUS) with 30-meter spatial resolution for the year 2021. We combine radar and optical multispectral imagery, with a physical climate parameter of Solar Induced Fluorescence (SIF)-based Growth Primary Production (GPP). Validation results show that a masked variation of UNet has the lowest validation RMSE of 37.93 ± 1.36 Mg C/ha, as compared to 81.95 ± 0.01 Mg C/ha (linear regressor), 53.37 ± 0.05 Mg C/ha (gradient boosting), and 52.30 ± 0.03 Mg C/ha for random forest algorithm. Furthermore, models that learn from SIF-based GPP in addition to radar and optical imagery reduce validation RMSE by almost 10% and the standard deviation by 40%.Biomass Estimation and Uncertainty Quantification From Tree Height
IEEE Journal of Selected Topics in Applied Earth Observations and Remote Sensing Institute of Electrical and Electronics Engineers (IEEE) 16 (2023) 4833-4845
Deep Semantic Model Fusion for Ancient Agricultural Terrace Detection
2022 IEEE International Conference on Big Data (Big Data) IEEE (2022) 4888-4892
Self-Supervised Learning in Remote Sensing: A review
IEEE Geoscience and Remote Sensing Magazine Institute of Electrical and Electronics Engineers (IEEE) 10:4 (2022) 213-247