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Insertion of STC into TRT at the Department of Physics, Oxford
Credit: CERN

Richard Nickerson

Associate Professor of Physics

Sub department

  • Particle Physics
Richard.Nickerson@physics.ox.ac.uk
Telephone: 01865 (2)73318,01865 (2)79201
Denys Wilkinson Building, room 625
  • About
  • Publications

The optical links of the ATLAS SemiConductor tracker

JOURNAL OF INSTRUMENTATION 2 (2007) ARTN P09003

Authors:

JA Wilson, A Abdesselam, PP Allport, RJ Apsimon, C Band, AJ Barr, L Batchelor, R Bates, P Bell, J Bernabeu, J Bizzell, R Brenner, T Brodbeck, P Bruckman de Renstrom, C Buttar, JR Carter, DG Charlton, A Cheplakov, A Chilingarov, ML Chu, A-P Colijn, I Dawson, B Demirkoz, P De Jong, PJ Dervan, Z Dolezal, JD Dowell, C Escobar, E Spencer, T Ekelof, L Eklund, D Ferrere, TJ Fraser, M French, R French, J Fuster, BJ Gallop, C Garcia, MJ Goodrick, A Greenall, AA Grillo, J Grosse-Knetter, F Hartjes, NP Hessey, JC Hill, RJ Homer, LS Hou, G Hughes, Y Ikegami, C Issever, JN Jackson, M Jones, TJ Jones, P Jovanovic, E Koffeman, P Kodys, T Kohriki, S-C Lee, CG Lester, M Limper, SW Lindsay, M Lozano, CP Macwaters, CA Magrath, G Mahout, I Mandic, J Matheson, TJ McMahon, B Mikulec, AJM Muijs, M Morrissey, A Nichols, RB Nickerson, V O'Shea, S Pagenis, MA Parker, J Pater, E Perrin, H Pernegger, SJM Peeters, PW Phillips, M Postranecky, D Robinson, A Robson, A Rudge, H Sandaker, K Sedlak, NA Smith, S Stapnes, B Stugu, PK Teng, S Terada, A Tricoli, M Tyndel, N Ujiie, M Ulln, Y Unno, E van der Kraaij, I van Vulpen, G Viehhauser, JH Vossebeld, MRM Warren, RL Wastie, AR Weidberg, PS Wells, DJ Whitet
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The barrel modules of the ATLAS semiconductor tracker

Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment 568:2 (2006) 642-671

Authors:

A Abdesselam, T Akimoto, PP Allport, J Alonso, B Anderson, L Andricek, F Anghinolfi, RJ Apsimon, G Barbier, AJ Barr, LE Batchelor, RL Bates, JR Batley, GA Beck, PJ Bell, A Belymam, J Bernabeu, S Bethke, JP Bizzell, J Bohm, R Brenner, TJ Brodbeck, Z Broklova, J Broz, P Bruckman De Renstrom, CM Buttar, JM Butterworth, C Carpentieri, AA Carter, JR Carter, DG Charlton, A Cheplakov, E Chesi, A Chilingarov, S Chouridou, ML Chu, V Cindro, A Ciocio, JV Civera, A Clark, P Coe, AP Colijn, T Cornelissen, DP Cosgrove, MJ Costa, W Dabrowski, J Dalmau, KM Danielsen, I Dawson, B Demirkoz, P Dervan, Z Dolezal, M Donega, M D'Onofrio, O Dorholt, JD Dowell, Z Drasal, IP Duerdoth, M Dwuznik, S Eckert, T Ekelof, L Eklund, C Escobar, V Fadeyev, L Feld, P Ferrari, D Ferrere, L Fiorini, R Fortin, JM Foster, H Fox, TJ Fraser, J Freestone, R French, J Fuster, S Gadomski, BJ Gallop, C García, JE Garcia-Navarro, MD Gibson, S Gibson, MGD Gilchriese, J Godlewski, S Gonzalez-Sevilla, MJ Goodrick, A Gorisek, E Gornicki, A Greenall, C Grigson, AA Grillo, J Grosse-Knetter, C Haber, K Hara, FG Hartjes, D Hauff, BM Hawes, SJ Haywood, NP Hessey, A Hicheur, JC Hill

Abstract:

This paper describes the silicon microstrip modules in the barrel section of the SemiConductor Tracker (SCT) of the ATLAS experiment at the CERN Large Hadron Collider (LHC). The module requirements, components and assembly techniques are given, as well as first results of the module performance on the fully assembled barrels that make up the detector being installed in the ATLAS experiment. © 2006 Elsevier B.V. All rights reserved.
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Robotic Mounting of ATLAS barrel SCT Modules

Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment 568 (2006) 686-691

Authors:

G Viehhauser, R. Nickerson, R. Wastie, S. Terada
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The barrel modules of the ATLAS semiconductor tracker

Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment A568 (2006) 642-671

Authors:

RB Nickerson, J. Carter, T. Akimotoa, P.P. Allport
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Design and performance of the ABCD3TA ASIC for readout of silicon strip detectors in the ATLAS semiconductor tracker

Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment 552:3 (2005) 292-328

Authors:

F Campabadal, C Fleta, M Key, M Lozano, C Martinez, G Pellegrini, JM Rafi, M Ullan, LG Johansen, B Mohn, O Oye, AO Solberg, B Stugu, A Ciocio, R Ely, V Fadeyev, M Gilchriese, C Haber, J Siegrist, H Spieler, C Vu, PJ Bell, DG Charlton, JD Dowell, BJ Gallop, RJ Homer, P Jovanovic, G Mahout, TJ McMahon, JA Wilson, AJ Barr, JR Carter, MJ Goodrick, JC Hill, CG Lester, MA Parker, D Robinson, F Anghinolfi, E Chesi, P Jarron, J Kaplon, A Macpherson, H Pernegger, T Pritchard, S Roe, A Rudge, P Weilhammer, W Bialas, W Dabrowski, M Dwuznik, B Toczek, S Koperny, P Bruckman, S Gadomski, E Gornicki, P Malecki, A Moszczynski, E Stanecka, R Szczygiel, M Turala, M Wolter, L Feld, C Ketterer, J Ludwigf, J Meinhardt, K Runge, AG Clark, M Donega, M D'Onofrio, D Ferrere, D La Marra, D Macina, M Mangin-Brinet, B Mikulec, A Zsenei, RL Bates, A Cheplakov, Y Iwata, T Ohsugi, Y Ikegami, T Kohriki, T Kondo, S Terada, N Ujiie, Y Unno, R Takashima, PP Allport, A Greenall, JN Jackson, TJ Jones, NA Smith, GA Beck, AA Carter, J Morris, J Morin, V Cindro, G Kramberger, I Mandić, M Mikuž, IP Duerdoth

Abstract:

The ABCD3TA is a 128-channel ASIC with binary architecture for the readout of silicon strip particle detectors in the Semiconductor Tracker of the ATLAS experiment at the Large Hadron Collider (LHC). The chip comprises fast front-end and amplitude discriminator circuits using bipolar devices, a binary pipeline for first level trigger latency, a second level derandomising buffer and data compression circuitry based on CMOS devices. It has been designed and fabricated in a BiCMOS radiation resistant process. Extensive testing of the ABCD3TA chips assembled into detector modules show that the design meets the specifications and maintains the required performance after irradiation up to a total ionising dose of 10 Mrad and a 1-MeV neutron equivalent fluence of 2×10 14 n/cm2, corresponding to 10 years of operation of the LHC at its design luminosity. Wafer screening and quality assurance procedures have been developed and implemented in large volume production to ensure that the chips assembled into modules meet the rigorous acceptance criteria. © 2005 Elsevier B.V. All rights reserved.
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