Modeling and Testing Superconducting Artificial CPW Lines Suitable for Parametric Amplification

(2023)

Authors:

FP Mena, D Valenzuela, C Espinoza, F Pizarro, B-K Tan, DJ Thoen, JJA Baselmans, R Finger

Engineering the thin film characteristics for optimal performance of superconducting kinetic inductance amplifiers using a rigorous modelling technique.

Open research Europe Faculty of 1000 2 (2023) 88

Authors:

Boon-Kok Tan, Faouzi Boussaha, Christine Chaumont, Joseph Longden, Javier Navarro Montilla

Abstract:

<b>Background:</b> Kinetic Inductance Travelling Wave Parametric Amplifiers (KITWPAs) are a variant of superconducting amplifier that can potentially achieve high gain with quantum-limited noise performance over broad bandwidth, which is important for many ultra-sensitive experiments. In this paper, we present a novel modelling technique that can better capture the electromagnetic behaviour of a KITWPA without the translation symmetry assumption, allowing us to flexibly explore the use of more complex transmission line structures and better predict their performance. <b>Methods:</b> In order to design a KITWPA with optimal performance, we investigate the use of different superconducting thin film materials, and compare their pros and cons in forming a high-gain low-loss medium feasible for amplification. We establish that if the film thickness can be controlled precisely, the material used has less impact on the performance of the device, as long as it is topologically defect-free and operating within its superconducting regime. With this insight, we propose the use of Titanium Nitride (TiN) film for our KITWPA as its critical temperature can be easily altered to suit our applications. We further investigate the topological effect of different commonly used superconducting transmission line structures with the TiN film, including the effect of various non-conducting materials required to form the amplifier. <b>Results:</b> Both of these comprehensive studies led us to two configurations of the KITWPA: 1) A low-loss 100 nm thick TiN coplanar waveguide amplifier, and 2) A compact 50 nm TiN inverted microstrip amplifier. We utilise the novel modelling technique described in the first part of the paper to explore and investigate the optimal design and operational setup required to achieve high gain with the broadest bandwidth for both KITWPAs, including the effect of loss. <b>Conclusions:</b> Finally, we conclude the paper with the actual layout and the predicted gain-bandwidth product of our KITWPAs.

Searching for wave-like dark matter with QSHS

SciPost Physics Proceedings SciPost 12 (2023)

Authors:

Ian Bailey, Bhaswati Chakraborty, Gemma Chapman, Edward J Daw, John Gallop, Gianluca Gregori, Edward Hardy, Ling Hao, Edward Laird, Peter Leek, John March-Russell, Phil Meeson, Seaárbhan Ó Peatáin, Yuri Pashkin, Mitchell G Perry, Michele Piscitelli, Edward Romans, Subir Sarkar, Paul J Smith, Ningqiang Song, Mahesh Soni, Boon Kok Tan, Stephen West, Stafford Withington

Abstract:

In 2021 the Quantum Sensors for the Hidden Sector (QSHS) collaboration was founded in the UK and received funding to develop and demonstrate quantum devices with the potential to detect hidden sector particles in the μeV to 100 μeV mass window. The collaboration has been developing a range of devices. It is building a high-field, low-temperature facility at the University of Sheffield to characterise and test the devices in a haloscope geometry. This paper introduces the collaboration's motivation, aims, and progress.

Analytical expressions for the design of twin junction tuning in SIS mixers

Engineering Research Express IOP Publishing 5:2 (2023) 025071

Authors:

J Wenninger, G Yassin, B-K Tan

Design of a 240GHz on-chip dual-polarization receiver for SIS mixer arrays

Superconductor Science and Technology IOP Publishing 36:5 (2023) 055012

Authors:

Jakob Wenninger, Faouzi Boussaha, Christine Chaumont, Boon Tan, Ghassan Yassin

Abstract:

We report the design of a compact dual-polarization on-chip superconductor–insulator–superconductor receiver for array applications. The planar-circuit receiver chip is comprised of the entire radio frequency (RF) signal processing chain with three main circuit components alongside some auxiliary circuits: (1) a polarization splitting 4-probe orthomode transducer (OMT) that couples the RF and local oscillator signal from free space to the chip via a drilled feedhorn; (2) two hybrids that recombine the power of each polarization from the two sets of orthogonal OMT probes; and (3) twin-junction Nb/AlOx/Nb mixers that downconvert the recombined signals to the intermediate frequency. We ensure that the four side walls of each pixel are free from obscuration, using only the top and bottom of the pixel for various connections. Consequently, the design is extendable to a large format array. In this paper, we present the detailed design of the on-chip receiver, including extensive heterodyne simulations and its potential extension into a large format array.