Improved Interconnecting Layer for Perovskite–Organic Tandem Solar Cells
Abstract:
Monolithic perovskite–organic tandem solar cells (POTSCs) have attracted considerable attention in recent years due to their compatible fabrication routes and advances in single-cell efficiencies. To further boost the performance of POTSCs, reducing the voltage losses that mainly arise from wide bandgap (WBG, >1.7 eV) perovskite subcells and interconnecting layers (ICLs) is critical. Here, a new ICL with a configuration of C60/YbO x /Au/MoO x is demonstrated for constructing the monolithic POTSC. The YbO x -based ICL benefits from an ohmic contact and high transparency, resulting in improved POSTC performance. The champion device presents a PCE of 23.2% owing to a high V OC of 2.11 V (approximately equal to the sum of individual V OC’s of the subcells) without compromising the short-circuit current density and fill factors. This work opens an avenue for developing efficient ICLs in POTSCs.Substrate-independent and antisolvent-free fabrication method for tin perovskite films via imidazole-complexed intermediates
Abstract:
The fabrication of metal halide perovskite thin films, particularly those containing Sn, relies heavily on the use of antisolvents. Film quality is strongly influenced by factors such as the choice of antisolvent, the primary precursor solvent, perovskite composition, and the size and wettability of the substrates. This complexity makes process optimization challenging and impedes the development of efficient tin perovskite solar cells (PSCs). In this work, we present a vacuum-quenching with crystal growth regulator (V-CGR) method, an antisolvent- and dimethyl sulfoxide (DMSO)-free, vacuum-assisted fabrication process for tin perovskite films whereby crystal growth could be regulated through the formation of intermediate films containing an amorphous [SnI2–(1-vinylimidazole)] complex. The V-CGR method is compatible with diverse perovskite compositions and substrates, enabling the formation of uniform tin perovskite films up to 7.5 × 7.5 cm2 and allowing device fabrication on hydrophobic hole-transporting monolayers such as MeO-2PACz and 2PACz.